3D IC Stacking Technology 1st Edition

3D IC Stacking Technology - Book ReviewWe really enjoyed reading the 3D-IC book. Below is feedback from our review:* Excellent book, gives great understanding of process parameters of 3D-TSV technology. Easily the best book we have seen on the subject.* The book provides the foundation technology for 3D IC Stacking using TSVA few comments:* A chapter on fine-pitch TSV technology (similar to what we wrote in our recent blog post:[...]) would be an important addition in future editions* A book on 3D should have at least one chapter on monolithic 3D. Monolithic 3D NAND flash is turning out to be a major area, with Toshiba, Samsung, etc talking about production in 2013-2014.* An in-depth analysis of the cost aspect and the technologies which present an opportunity to reduce the 3D IC cost (and allow wide spread adoption) would help.We strongly recommend this book to technologists who like to get basic understanding on this emerging field, and to those that are already working in this exciting new field.Zvi Or-Bach and Deepak Sekar